Date: 11th - 13th September
Location: Berlin, German
In September, staff from our Interconnect team travelled to the 10th IEEE Electronics System-Integration Technology Conference in Berlin.
ESTC, held every two years, is a premier international forum for experts in the electronics packaging and systems integration field to network and share their research.
On behalf of our Interconnect group, Andreas Schneider presented his paper 'Single Die Process Using Shadow Masks for a 55µm Fine Pitch Array of 4µm-tall Indium Bumps Across an Entire Chip'.
This work was funded thanks to the STFC's Centre for Instrumentation which is designed to prepare for our next-generation instrumentation systems.
Read Andreas' full paper.
